It performs complex, highly accurate and
reliable inspections by contacting vertically with the device.
Ultra-fine diameter wire probes (S-Series) suit even narrower pitches
for
semiconductor wafer inspection.
| Probe Specification | Ф74μmTYPE | Ф63μmTYPE | Ф50μmTYPE | Ф38μmTYPE |
|---|---|---|---|---|
| Wire diameter (mm) ФD | 0.074 | 0.063 | 0.050 | 0.038 |
| Insulation coating diameter (mm) ФOD | 0.093 | 0.083 | 0.070 | 0.050 |
| Total length (mm) L | 11.18 | 11.18 | 8.50 | 8.50 |
| Conductor material | Palladium alloy (AgPdCu) | |||
| Insulation coating material | Acrylic resin | |||
